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  data sheet 1 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 general description the ap3031 is an inductor-based dc/dc boost con- verter designed to drive led arrays. 1.4a switching current allows ap3031 to be used in different 7' to 10' lcd panel backlights (3*13 led arrays typically). a constant frequency 1mhz pwm control scheme is employed in this ic, which means tiny external com- ponents can be used. specifically, 1mm tall 4.7 h inductor and 0.47 f output capacitor for the typical application is sufficient. the over output voltage protection is equipped in ap3031, which protects the ic under open load condi- tion. the ap3031 includes uvlo, soft-start, current limit and otsd to protect the circuit. the ap3031 is available in standard sot-23-6, tsot- 23-6 and soic-8 packages. features up to 92% efficiency (v in =9v, i out =260ma) up to 84% efficiency (v in =5v, i out =260ma) fast 1mhz switching frequency wide input voltage range: 2.7v to 16v low 200mv feedback voltage output over voltage protection cycle by cycle current limit: 1.4a built-in soft-start built-in standby mode to achieve high fre- quency pwm dimming built-in thermal shutdown function under voltage lockout applications 7' to 10' lcd panels digital photo frame gps receiver epc pdvd figure 1. package types of ap3031 sot-23-6 tsot-23-6 soic-8
data sheet 2 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 figure 2. pin configuration of ap3031 (top view) pin configuration pin description pin number pin name function 6-pin 8-pin 1 4 sw switch pin. connect exte rnal inductor and schottky 2 2, 3, 6 gnd ground pin 3 1 fb voltage feedback pin. reference voltage is 200mv 4 8ctrl enable and dimming control pin. connect to a high input to enable the ic or a low input to disable the ic. if logic low time is more than about 0.7ms and then enab le the ic, the ap3031 will soft start to protect system depar tments. if logic low time is less than about 0.7ms and then enable the ic, the ap3031 will hold on standby mode and star t directly to achiev e high frequency dimming 5 7 ov over-voltage protection input pin. connect to the output dire ctly. on ovp condition, the out- put voltage will be clamped 65 v in input supply pin. must be locally bypassed (sot-23-6/tsot-23-6) sw gnd fb v in ov ctrl k/kt package (soic-8) m package 1 2 3 4 8 7 6 5 sw gnd fb gnd v in ov ctrl gnd 1 2 34 5 pin 1 mark 6
data sheet 3 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 q1 a2 a1 1mhz oscillator ramp generator v ref driver 1.25 v comparator 200 mv soft start v in ctrl fb gnd sw standby ov to control logic control logic over temperature detector ov functional block diagram figure 3. functional block diagram of ap3031 circuit type package k: sot-23-6 ap3031 - blank: tube ordering information package temperature range part number marking id packing type sot-23-6 -40 to 85 o c ap3031ktr-g1 gec tape & reel tsot-23-6 ap3031kttr-g1 l1e tape & reel soic-8 ap3031m-g1 3031m-g1 tube AP3031MTR-G1 3031m-g1 tape & reel bcd semiconductor's pb-free products, as de signated with "g1" suffix in the part number, are rohs compliant and green. g1: green 1 (4) 2 3 (1) 4 (8) 5 (7) 6 (5) a (b) a sot-23-6/tsot-23-6 b soic-8 (2, 3, 6) kt: tsot-23-6 m: soic-8 tr: tape and reel
data sheet 4 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 parameter symbol value unit input voltage v in 20 v sw voltage v sw 38 v fb voltage v fb 20 v ctrl voltage v ctrl 20 v thermal resistance (junction to ambient, no heat sink) ja sot-23-6/tsot-23-6 265 o c/w soic-8 120 operating junction temperature t j 150 o c storage temperature range t stg -65 to 150 o c lead temperature (soldering, 10sec) t lead 260 o c esd (machine model) 600 v esd (human body model) 4000 v note 1: stresses greater than those listed und er "absolute maximum rati ngs" may cause permanent damage to the device. these are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "a bsolute maximum ratings " for extended periods may affect device reliability. parameter symbol min max unit operating temperature range t op -40 85 o c input voltage v in 2.7 16 v ctrl voltage v ctrl 16 v recommended operating conditions absolute maximum ratings (note 1)
data sheet 5 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 parameter symbol conditions min typ max unit operating voltage v in 2.7 16 v feedback voltage (note 2) v fb i out =20ma, 3 leds, t a =-40 o c to 85 o c 188 200 212 mv fb pin bias current i fb 35 100 na quiescent current i q v fb =v in , no switching 3.0 4.0 5.0 ma shutdown quiescent current i shdn v ctrl =0v 20 50 80 a switching frequency f 0.75 1 1.3 mhz maximum duty cycle d max 90 93 % switch current limit (note 3) i limit d=60% 1.2 1.4 a switch v ce saturation voltage v cesat i sw =0.6a 300 mv switch leakage current v sw =16v 0.01 5 a ctrl pin voltage v ctrl active high 1.8 v active low 0.5 ctrl pin bias current i ctrl 35 60 85 a ovp voltage v ovp 15.5 17.5 19.5 v soft-start time t ss 250 s standby time t stb 0.7 ms thermal shutdown t otsd 155 o c thermal resistance (junction to case) jc 60 o c/w (v in =5.0v, v ctrl =5.0v , t a =25 o c, unless otherw ise specified.) electrical characteristics note 2: the bold type specifications of full temperature range are guar anteed by design (gbd). note 3: the switch current limit is related to duty cycle. please refer to figure 15 for detail.
data sheet 6 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 typical performance characteristics figure 6. minimum operating voltage vs. temperat ure figure 7. quiescent current vs. input voltage figure 4. efficiency vs. output current figure 5. efficiency vs. input voltage (wled forward voltage (v f )=3.2v at i f =20ma, unless otherwise noted.) 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 45 50 55 60 65 70 75 80 85 90 efficiency (%) output current (ma) v in =5v, v out =10v, t a =25 o c c in =10 f, c out =0.47 f, l=4.7 h 3.54.04.55.05.56.06.57.07.58.08.59.09.5 50 55 60 65 70 75 80 85 90 95 efficiency (%) input voltage (v) v out =10v, i out =260ma,t a =25 o c c in =10 f, c out =0.47 f, l=4.7 h -60 -40 -20 0 20 40 60 80 100 120 140 2.20 2.25 2.30 2.35 2.40 2.45 2.50 2.55 2.60 2.65 2.70 minimum operating voltage (v) temperature ( o c) 2 4 6 8 10 12 14 16 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 quiescent current (ma) input voltage (v) t a = -40 o c t a = 25 o c t a = 85 o c
data sheet 7 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 typical performance ch aracteristics (continued) figure 10. ctrl pin curr ent vs. ctrl pin voltage figure 8. shutdown quiescent current vs. input voltage figure 9. ctrl pin voltage vs. temperature figure 11. feedback voltage vs. temperature 2 4 6 8 10 12 14 16 40 45 50 55 60 65 70 75 80 85 shutdown quiescent current ( a) input voltage (v) t a = -40 o c t a = 25 o c t a = 85 o c (wled forward voltage (v f )=3.2v at i f =20ma, unless otherwise noted.) -60 -40 -20 0 20 40 60 80 100 120 140 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 ctrl pin voltage (v) temperature ( o c) 2 4 6 8 1012141618 20 40 60 80 100 120 140 160 180 200 220 ctrl pin current ( a) ctrl pin voltage (v) -60 -40 -20 0 20 40 60 80 100 120 140 188 190 192 194 196 198 200 202 204 206 208 210 212 feedback voltage (mv) temperature ( o c) i out = 20ma
data sheet 8 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 figure 13. ovp voltage vs. temperature typical performance ch aracteristics (continued) figure 12. frequency vs. temperature figure 14. frequency vs. input voltage figure 15. switch curren t limit vs. duty cycle (wled forward voltage (v f )=3.2v at i f =20ma, unless otherwise noted.) -60 -40 -20 0 20 40 60 80 100 120 140 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 frequency (mhz) temperature ( o c) -60 -40 -20 0 20 40 60 80 100 120 140 14 15 16 17 18 19 20 ovp voltage (v) temperature ( o c) 2 4 6 8 1012141618 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 frequency (mhz) input voltage (v) 10 20 30 40 50 60 70 80 90 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 switch current limit (a) duty cycle (%) t a =-40 o c t a =25 o c t a =85 o c
data sheet 9 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 typical performance ch aracteristics (continued) figure 16. switch saturation voltage vs. switch current figure 17. case temperature vs. output current (wled forward voltage (v f )=3.2v at i f =20ma, unless otherwise noted.) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 50 100 150 200 250 300 350 400 450 500 550 600 650 switch saturation voltage (mv) switch current (a) t a =-40 o c t a =25 o c t a =85 o c 0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 30 35 40 45 50 55 60 65 70 75 80 case temperature ( o c) output current (ma) v in =5v, v out =10v, t a =25 o c c in =10 f, c out =0.47 f, l=4.7 h
data sheet 10 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 application information operation the ap3031 is a boost dc-dc converter which uses a constant frequency, current mode control scheme to provide excellent line and load regulation. operation can be best understood by referring to figure 3 and figure 24. at the start of each oscillato r cycle, switch q1 turns on. the switch current will in crease linearly. the voltage on sense resistor is proporti onal to the switch current. the output of the current sens e amplifier is added to a stabilizing ramp and the result is fed into the non- inversion input of the pwm comparator a2. when this voltage exceeds the output vol tage level of the error amplifier a1, the switch is turned off. it is clear that the voltage level at inversion input of a2 sets the peak current level to keep the output in regulation. this voltage le vel is the output signal of error amplifier a1, and is the amplified signal of the voltage difference between feedback voltage and reference voltage of 200mv. so, a constant output current can be provided by this operation mode. led current control refer to figure 24, the led current is controlled by the feedback resistor r iset . leds' current accuracy is determined by the feedback voltage and resistor r iset , so the precise resistors are preferred. the resistance of r iset is in inverse proportion to the led current since the feedback reference is fixed at 200mv. the relation for r iset and led current (i led )can be expressed as below: over voltage protection the ap3031 has an internal open load protection circuit. when the leds are disconnected from circuit or fail open, the output voltage is clamped at about 17.5v. the ap3031 will switch at a low frequency, and minimize current to avoid input voltage drop. soft start the ap3031 has an internal soft start circuit to limit the inrush current during startup. if logic low time on ctrl pin is more than a bout 0.7ms and then enable the ic, the ap3031 will start smoothly to protect the supplier. the time of startup is controlled by internal soft-start capacitor. details please refer to figure 18. figure 18. soft-start waveform v in =5v, 3 13 leds, i led =260ma standby and dimming to avoid audio noise and achieve high frequency dim- ming, ap3031 is equipped with standby function. if logic low time on ctrl pin is less than about 0.7ms and then enable the ic, the ap3031 will hold on standby mode and start directly to achieve high fre- quency dimming. details please refer to figure 19. figure 19. standby waveform two typical types of dimming control circuit are present as below. first, co ntrolling ctrl pin voltage to change operation state is a good choice. second, led iset i mv 200 r = v ctrl 5v/div v out 10v/div time 80 s/div v sw 5v/div i l 500ma/div v ctrl 5v/div v out 10v/div time 80 s/div v sw 5v/div i l 500ma/div >0.7ms <0.7ms
data sheet 11 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 application information (continued) changing the feedback voltag e to get appropriate duty and luminous intensity is also useful. (1) adding a control signal to ctrl pin adding a pwm signal to ctrl pin directly, the ap3031 is turned on and off by this signal. when the pwm frequency is lower than 1khz(typ.), the ic works in the soft-start mode to dimming the light. on contrary, when the pwm frequency is higher than 1khz(typ.), the ic works in the standby mode: the converter ceaselessly switches off and directly starts to achieve light dimming. this standby function allows ap3031 to support high frequency dimming (up to 25khz or higher) to avoid audio noise. more details please refer to figure 20 and figure 21. figure 20. dimming control using a pwm signal in ctrl pin figure 21. high frequency (25khz) dimming waveform (2) changing the eff ective feedback voltage there are two popular method s to change the effective feedback voltage. first, adding a constant dc voltage through a resistor divider to fb pin can control the dimming. changing the dc voltage or resistor between the fb pin and the dc voltage can get appropriate luminous intensity. comparing with all kinds of pwm signal control, this method features a stable output voltage and leds current. please refer to figure 22. figure 22. dimming control using dc voltage second, using a filtered pwm signal can do it. the filtered pwm signal can be considered as a varying and adjustable dc voltage, please refer to figure 23. figure 23. dimming control using filtered pwm voltage v ctrl 2.5v/div time 20 s/div v sw 5v/div i l 500ma/div r1 a01 r2 r v c eive eed ve r1 a01 r2 r w r c eive eed ve a01 ctrl
data sheet 12 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 typical application fb ap3031 gnd v in sw ctrl c in 10 f c out 0.47 f v in 5v v out l4.7 h r iset 3*13 on /off d ov 3 13 wleds booster for lnb application (note 4) l1 d1 c in r3 r4 r2 r1 v in sw ctrl gnd fb ov v in 12v v out 18v c out ap3031
data sheet 13 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 typical application (continued) booster for portable charger application (note 4) note 4: v out =(1+r1/r2)*v fb figure 24. typical application of ap3031 l1 ap3031 d1 c in r2 r1 vin sw ctrl gnd fb ov v in 3.6v v out 5v c out
data sheet 14 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 mechanical dimensions sot-23-6 unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)typ 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)ref 0.100(0.004) 0.200(0.008) 0 8 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) max 123 4 5 6 pin 1 mark
data sheet 15 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 mechanical dimens ions (continued) tsot-23-6 unit: mm(inch) 2.800(0.110) 3.000(0.118) 1.500(0.059) 1.700(0.067) 2.600(0.102) 3.000(0.118) 0.950(0.037) bsc 1.900(0.075) bsc 0.700(0.028) 0.900(0.035) 0.000(0.000) 0.100(0.004) 0.350(0.014) 0.510(0.020) 0 8 0.370(0.015) min 0.100(0.004) 0.250(0.010) 0.250(0.010) bsc gauge plane r0.100(0.004) min pin 1 mark 1.000(0.039) max
data sheet 16 dec. 2012 rev. 1. 6 bcd semiconductor manufacturing limited white led step-up converter ap3031 mechanical dimens ions (continued) soic-8 unit: mm(inch) 0 8 1 5 r 0 . 1 5 0 ( 0 . 0 0 6 ) r0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 7 7 2 0 : 1 d 1.270(0.050) typ 0.190(0.007) 0.250(0.010) 8 d 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 8 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) note: eject hole, oriented hole and mold mark is optional.
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited


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